ISO9001:2008
AS9100:2009
CERTIFIED
COMPANY

EMPLOYEE
OWNED
COMPANY

 

Product Flow Summary

Typical DEI Ceramic Package

 

   

         
Process Description 883/B  Standard  Std Burn-In Comments, Notes
Incoming Wafer Inspection Yes Yes Yes  
Wafer Probe 100% Sample Sample  
Wafer Saw Yes Yes Yes  
2nd Optical Inspection 100% 100% 100% 883 M2010 Cond B 
Die Attach Yes Yes Yes Monitor 883 M2027 
Wire Bond Yes Yes Yes Monitor 883 M2011 Cond D 
3rd Optical Inspection 100% 100% 100% 883 M2010 Cond B 
Lid Cap & Seal Yes Yes Yes  
Temp Cycle 100% 100% 100% 883 M1010.7 Cond C, 10 Cycles 
Centrifuge 100% No No  883 M2001 Cod E, Y1 Axis
Mark Yes Yes Yes  Monitor 883 M2015
Gross & Fine Leak 100% 100% 100%  882 M1014.10 Cond C1 & A1
Visual Inspection 100%  100% 100%  883 M2009
Pre Burn-In Electrical Test, Room 100%  No 100%  
Pre Burn-In Electrical Test, Hot/Cold  Sample or 100%  No Sample or 100%   As required by product
Burn-In  100% No  100%   883 M1015 Class B
Electrical Test, Room Temperature 100% 100%  100%  5% PDA
Electrical Test, Hot Temperature 100% 100% 100%  
Electrical Test, Cold Temperature 100%  0.65% AQL 0.65% AQL  
Gross & Fine Leak  100%  No No   
Final Visual & Coplanarity Inspection 100%  100% 100%  
Pack & Ship Yes  Yes Yes  
         
QCI Group A Inspections Each Lot  No  No  883 M5005 
QCI Group B Inspections Each Lot No  No 883 M5005  
QCI Group C Inspections Periodic  No No 883 M5005  
QCI Group D Inspections Periodic No No 883 M5005  

 

Device Engineering is an AS9100:2009 Rev.C and ISO9001:2008 certified design and manufacturing facility specializing in Analog and Mixed Signal Integrated Circuits.

 

© 2011-2017  Device Engineering  All rights reserved

Our Services

Our Testimonials

Contact Us

Device Engineering Incorporated
385 East Alamo Drive
Chandler AZ 85225

P: 480-303-0822

F: 480-303-0824

www.deiaz.com