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  Power Control 
  DEI1028 Voltage Clamping Circuit
 
   
DEI1028Data Sheet

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Features:
  • Clamps transients on both avionics and industrial power busses
  • Permits use of a variety of power supplies and OP Amps
  • Small foot print (8L SOIC NB)
  • Wide input voltage range
  • Programmable Undervoltage Lockout
  • Stable over temperature
  • Active low On/Off Pin
  • Soft start
  • Highly versatile
 
       
   

GENERAL DESCRIPTION
The DEI 1028 is designed to provide the control for a power supply voltage clamp. It provides drive for a wide variety of P-Channel MOSFETS, linearly clamping the output. There is also a programmable Undervoltage Lockout feature that shuts the Power MOSFET off. Output voltage is maintained below the clamping threshold for Commercial-Off-The-Shelf switching supplies and op amps. If the clamping threshold is exceeded the out-put voltage is clamped at 35V maximum. The device is protected against a 100V spike of 100ms duration with over and undershoot protection

An open collector logic output is also provided that can be used as a power down interrupt for the system micro-processor.

 
   
Voltage Clamping Circuit Block Diagram

DEI1028 BLOCK DIAGRAM

 
       
            DEI1090 LED Driver with Square Law Dimming Control
 
       

DEI1090 Datasheet

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Features:
  • Emulates incandescent lamp "Square Law" luminance curve.
  • LED dimming controlled by Pulse Width Modulation ranging from 50HZ to 200HZ.
  • LED current adjustable from 10mA to 20mA.
  • 200:1 Dimming Range at 50Hz. 40:1 Dimming Range at 200Hz
  • Drives 8 LED outputs with matched current drive.
  • Drivers can be cascaded to synchronously drive additional LEDs.
  • Plastic 16 lead SOIC package.
 
               
           

GENERAL DESCRIPTION
The DEI1090 device is a 16 pin bipolar integrated circuit designed to drive nine LEDs and provide Pulse Width Modulated (PWM) dimming control according to the luminance curve of incandescent lamps. The device squares the analog control input and produces a PWM waveform used to enable or disable the current outputs. The LED brightness is controlled by the PWM duty cycle. All nine LEDs are driven at the same adjustable drive current. Drivers can be cascaded to synchronously drive additional LED groups. The dimming control input may be a DC or AC voltage.

 
           
LED Dimmer Block Diagram

DEI1090 BLOCK DIAGRAM

 
           
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Product Flow Summary

Typical DEI Plastic SMT Package

 

     

     
Process Description Burn-In Standard
Incoming Wafer Inspection Yes Yes
Wafer Probe Sample Sample
Wafer Saw Yes Yes
2nd Optical Inspection Yes Yes
Die Attach Yes Yes
Wire Bond Yes Yes
3rd Optical Inspection Yes Yes
Mold & Cure Yes Yes
Mark (Laser or Ink) Yes Yes
Mark Permanency (Ink) Sample Sample
Lead Finish Yes Yes
Trim/Form/Singulation Yes Yes
Package QC Final Visual & Lot Acceptance Yes Yes
Pre-Electrical Visual Inspection Yes Yes
Pre Burn-In Electrical Test, Room/Hot/Cold 100% Room & Hot, Sample Cold No
HTRB Burn-in, 125°C, 160hr 100% No
Electrical Test, Room Temperature 100% 100%
Electrical Test, Hot Temperature 100% 100%
Electrical Test, Cold Temperature 0.65% AQL 0.65% AQL
Final Visual & Coplanarity Inspection 100% 100%
Bake & Dry Pack Yes Yes
Pack & Ship Yes Yes

 

Device Engineering is an AS9100:2009 Rev.C and ISO9001:2008 certified design and manufacturing facility specializing in Analog and Mixed Signal Integrated Circuits.

© 2011-2017  Device Engineering  All rights reserved

   
 
 
 

By virtue of our 25 years of experience, Device Engineering matches the right processing technology with the product requirements.    There is no need to compromise on system design to fit processing capabilities.  Unlike other design houses who will design your circuits to the technology that is available to them, Device Engineering has no process technology limits. This allows us to design devices that both meet stringent requirements and are delivered at the lowest possible cost.

Low price/high volume, low power, low voltage, special signal conditioning, high voltage, and many more design capabilities can be utilized and mixed to fit your specific application.

 
 

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Device Engineering can package your custom circuits in any standard package available in the industry from DIPs to BGAs. Non Standard packages such as heat spreaders are also available.

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Device Engineering Incorporated
385 E. Alamo Dr.
Chandler,   AZ  85225
Phone: (480) 303-0822
Fax: (480) 303-0824
E-mail: [email protected]

 

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