ISO9001:2008
AS9100:2009
CERTIFIED
COMPANY

EMPLOYEE
OWNED
COMPANY

 

   
 
 
 

Device Engineering can package your custom circuits in any standard package available in the industry from DIPs to BGAs. Non Standard packages such as heat spreaders are also available.

  • DIP (Plastic, Ceramic, Side Brazed)
  • SOIC - NB(150mil) or WB(300mil)
  • SSOP
  • TSSOP
  • PLCC
  • MQFP
  • MLPQ
  • BGA
  • µBGA
  • Many more...
 
 

Packaging info for standard products

   
 

© 2011-2017  Device Engineering  All rights reserved

   

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Device Engineering Incorporated
385 East Alamo Drive
Chandler AZ 85225

P: 480-303-0822

F: 480-303-0824

www.deiaz.com