Device Engineering can package your custom circuits in any standard package available in the industry from DIPs to BGAs. Non Standard packages such as heat spreaders are also available.

  • DIP (Plastic, Ceramic, Side Brazed)
  • SOIC - NB(150mil) or WB(300mil)
  • SSOP
  • TSSOP
  • PLCC
  • MQFP
  • MLPQ
  • BGA
  • µBGA
  • Many more...
 
 

Packaging info for standard products

   
 

© 2011-2017  Device Engineering  All rights reserved

   

Our Services

Our Testimonials

Contact Us

Device Engineering Incorporated
385 East Alamo Drive
Chandler AZ 85225

P: 480-303-0822

F: 480-303-0824

www.deiaz.com