ISO9001:2015
AS9100D CERTIFIED COMPANY

MILITARY AND AEROSPACE

ARINC429

News From DEI

DEI is proud to announce that we have appointed Celte srl to be our exclusive Representative and Distributor for the Italian marketplace.

Celte, headquartered in Milan and founded in 1982, is an ISO9001:2008 certified company which is focused upon the Mil/Aero, Space, Telecom and Industrial markets.

  

Celte Homepage 

 

Product Highlight

DEI1026 'non-A' - Our 6-channel discrete-to-digital interface IC is BACK by popular demand.  DEI is rehosting it at a new foundry and the 'new' DEI1026 is fit, form and functionally equivalent to the 'old' DEI1026.  Samples available shortly, contact factory for more information.

 

DEI1026 Data Sheet 

 News From DEI

DEI  were awarded a 3 Star Supplier Award on May 21st, 2019 by Raytheon IDS for 2018 performance.  DEI President & CEO, Robert Sharman (center) is shown with senior Raytheon IDS Supply Chain executives.

 

 

Site Location

ISO9001:2015
AS9100D
CERTIFIED
COMPANY

EMPLOYEE
OWNED
COMPANY

 

SERVICES ANIM

Device Engineering Inc (DEI) is a fabless semiconductor manufacturer that supplies a portfolio of standard products targeted primarily toward avionics including transceivers/receivers/drivers for Arinc 429 and other communications protocols; discrete/digital converters; and other general purpose components.  DEI also supplies a select offering of mixed-signal ASICs and analog arrays, specializing in hard-to-find technologies like high voltage; trailing edge/ obsolete replacement; RF; stitched reticle and voltage transient immunity.  Markets served are primarily Mil/Aero, Commercial Aerospace, Medical and high-end Industrial.  DEI is certified to AS9100D and ISO 9001:2015 Quality Standards.

 

© 2011-2019  Device Engineering  All rights reserved

Device Engineering Inc. is committed to industry best practices in worker safety

and fairness, environmental responsibility, business ethics, integrity and efficiency, and requires the

same of all of its business partners.

 

The Responsible Business Alliance (RBA), formerly the Electronic Industry Citizenship Coalition

(EICC), Code of Conduct establishes standards to ensure that working conditions in the electronics

industry or industries in which electronics is a key component and its supply chains are safe, that

workers are treated with respect and dignity, and that business operations are environmentally

responsible and conducted ethically.

 

The RBA Code of Conduct provides guidance in five critical areas of CSR performance:

*Labor *Health and Safety *Environment *Business Ethics *Management System

The current version of the RBA Code of Conduct endorsed by Device Engineering is available at:

http://www.responsiblebusiness.org/standards/code-of-conduct/

 

 

 

© 2011-2019  Device Engineering  All rights reserved

DEI Product Change Notices

Product Family PCNs

BD429/DEI0429

File Name Issue Date Description
CN-MW-00429-09-A.pdf 01-15-2016 EOL for DEI0429-NES PDIP
CN-MW-00429-08-B.pdf 08-23-2012 New Wafer Fabrication Site for BD429 A429 Line Driver Family
CN-MW-00429-07-A.pdf 10-31-2006 Alternate site qualified for DEI0429-Wxx CSOP package assembly.
CN-MW-00429-06-A.pdf 06-13-2005 DEI0429-WMS/WMB ARINC 429 LINE DRIVER IC Die attach material change.
CN-MW-00429-05-A.pdf 03-04-2004 Alternate site qualified for BD429 CERDIP package assembly.
CN-MW-00429-04-A.pdf 03-04-2004 Qualification of EME6600HR mold compound for SOIC packages.
CN-MW-00429-03-A.pdf 04-19-2002 BD429 ARINC 429 Line Driver CERDIP assembly line change.
CN-MW-00429-02-A.pdf 04-19-2002 DEI ARINC 429 Line Driver Family retargeted on 6” Wafer Fab.
CN-MW-00429-01-A.pdf 04-19-2002 BD429A ARINC 429 Line Driver package material changed to provide Level 2 moisture sensitivity.

 

DEI1016

File Name Issue Date Description
CN-MW-01016-07-A.pdf 05-23-2018 EOL for DEI1016 SnPb PLCC and PQFP Packages
CN-MW-01016-06-A.pdf 11-27-2015 EOL for DEI1016-Mxx MLPQ
CN-MW-01016-05-A.pdf 02-06-2015 EOL for DEI1016C PDIP
CN-MW-01016-04-A.pdf 02-19-2010 DEI1016A ARINC Transceiver 44 Lead PQFP Package material changed to provide Level 2 moisture sensitivity.
CN-MW-01016-03-A.pdf 07-27-2004 Alternate site qualified for DEI1016C package assembly.
CN-MW-01016-02-A.pdf 07-30-2003 DEI1016A ARINC Transceiver 44 Lead PQFP Package material changed to provide Level 2 moisture sensitivity.

 

DEI1022

File Name Issue Date Description
CN-MW-01022-01-A.pdf 04-19-2002 DEI1022/3/4/5 ARINC 429 Line Driver 14 lead NB SOIC assembly line change. Package material changed to provide Level 2 moisture sensitivity.

 

DEI1026

File Name Issue Date Description
CN-MW-01026-03-A.pdf 01-24-2019 New Wafer Fabrication Site for DEI1026A Discrete Interface IC
CN-MW-01026-02-A.pdf 01-05-2016 New Wafer Fabrication Site for DEI1026A family
CN-MW-01026-01-D.pdf 07-03-2014 New Wafer Fabrication Site for DEI1026 (non-A version)

 

DEI1028

File Name Issue Date Description
CN-MW-01028-02-A.pdf 05-22-2017 1028D mask revision for yield enhancement
CN-MW-01028-01-A.pdf 03-18-2016 New Wafer Fabrication Site for DEI1028

 

DEI1030

File Name Issue Date Description
CN-MW-01030-01-A.pdf 07-19-2017 DEI1030 Spec relaxation at cold temperature

 

DEI1038

File Name Issue Date Description
 CN-MW-01038-01-A.pdf 08-25-2015 New Wafer Fabrication Site for DEI1038 A429 Line Driver(1062D2 die)

  

DEI1041

File Name Issue Date Description
CN-MW-01041-02-A.pdf 03-05-2019 New Wafer Fabrication Site for DEI1041
CN-MW-01041-01-A.pdf 10-24-2014 New Wafer Fabrication Site for DEI1041

 

DEI1044

File Name Issue Date Description
CN-MW-01044-04-A.pdf 02-19-2019 DEI1044/1045 EOL with DEI1044A/1045A Replacements
CN-MW-01044-03-A.pdf 03-18-2016 Specification Change to DEI1044T-TES-G
CN-MW-01044-02-B.pdf 07-06-2012 New Wafer Fabrication Site for DEI1044
CN-MW-01044-01-A.pdf 03-04-2004 DEI1044 resistor geometry change to enhance yield.

 

DEI1046

File Name Issue Date Description
CN-MW-01046-03-A.pdf 11-02-2018 DEI1046 EOL with DEI1046A Replacement
CN-MW-01046-02-A.pdf 07-27-2018 DEI1046 & DEI1148 Specification and Datasheet change
CN-MW-01046-01-B.pdf 09-04-2014 New Wafer Fabrication Site for DEI1046/47

 

DEI1047

File Name Issue Date Description
CN-MW-01047-01-A.pdf 06-21-2018 EOL for DEI1047-TES-G  & DEI1047-TMS-G Products

 

DEI1054

File Name Issue Date Description
CN-MW-01054-01-A.pdf 09-28-2012 New Wafer Fabrication Site for DEI1054

 

DEI1067

File Name Issue Date Description
CN-MW-01067-01-A.pdf 06-26-2018 New Wafer Fabrication Site for DEI1067 Discrete Interface IC

 

DEI1070

File Name Issue Date Description
CN-MW-01070-03-B.pdf 12-07-2010 Added Date Codes to PCN Details Table.
CN-MW-01070-02-A.pdf 09-14-2009 End Of Life notification for DEI1070 family.
CN-MW-01070-01-A.pdf 11-11-2004 DEI1070 Circuit change to eliminate power sequencing limitation.

 

DEI1160

File Name Issue Date Description
CN-MW-01160-02-A.pdf 03-24-2014 The (non-A) version of the DEI1160 is End of Life.  The replacement part is DEI1160A. The DEI1160A-SES & -SMS products have improved electrical specifications compared to the non-A versions.
CN-MW-01160-01-B.pdf 01-04-2013 Updated to include material with DC = 1125

  

DEI1166

File Name Issue Date Description
CN-MW-01166-01-A.pdf  02-01-2019  New Wafer Fabrication Site for DEI1166

  

DEI1167

File Name Issue Date Description
CN-MW-01167-01-A.pdf  01-16-2015  New Wafer Fabrication Site for the DEI1167 family

 

DEI1170

File Name Issue Date Description
CN-MW-01170-01-A.pdf 05-07-2012 Change to output resistance specification for DEI1170A and DEI1171A.

 

DEI1184/1188

File Name Issue Date Description
CN-MW-01188-01-A.pdf 06-22-2018 DEI1188 die change to 1180_5
CN-MW-01184-01-A.pdf 06-18-2018 DEI1184 die mask change to enhance VIH and IIH characteristics.

 

DEI1198

File Name Issue Date Description
CN-MW-01198-02-A.pdf 05-10-2019 DEI1198 Specification and Datasheet change
CN-MW-01198-01-A.pdf 11-14-2018 DEI1198-TMS-G Mold Compound change to G700

 

DEI1282/1284

File Name Issue Date Description
CN-MW-01284-01-A.pdf 06-01-2018 DEI1284 die change to 1282_5
CN-MW-01282-01-A.pdf 05-23-2018 DEI1282 die change to 1282_4

 

DEI2084

File Name Issue Date Description
CN-MW-02084-01-A.pdf 09-27-2016 New Assembly Site for 64QFN9x9 Package

 

DEI3182

File Name Issue Date Description
CN-MW-03182-03-A.pdf 02-09-2016 DEI3182A mask revision for yield enhancement
CN-MW-03182-02-A.pdf 04-04-2013 New Wafer Fabrication Site for DEI3182A
CN-MW-03182-01-A.pdf 06-06-2005 DEI3182 Circuit change to increase lightning transient immunity.

 

DEI3283

File Name Issue Date Description
CN-MW-03283-01-A.pdf 09-20-2011 New Assembly Site for 20L SOIC.

 

DEI5090

File Name Issue Date Description
CN-MW-05090-01-A.pdf 11-16-2018 DEI5090 die change to 5090_4

  

General Purpose PCNs

File Name Issue Date Description
CN-MW-10068-01-B.pdf 04-23-2019 New Assembly Site for SOIC and TSSOP Packages
CN-MW-10057-01-B.pdf 11-29-2018 New Assembly Site for QFP Packages
CN-MW-10055-02-A.pdf 03-17-2016 Improved MSL Rating for 16SOICW Package
CN-MW-10055-01-B.pdf 01-21-2015 New Assembly Site for 16L SOIC WB Package
CN-MW-10054-01-B.pdf 03-17-2014 Alternate Assembly Site and Method Qualified for Ceramic Packages with Encapsulated Die
CN-MW-10052-01-A.pdf 05-20-2013 Alternate Assembly Site Qualified for Ceramic Packages
CN-MW-10051-01-A.pdf 05-20-2013 Change MMT PLCC & SOIC Mold Compound
CN-MW-10700-01-A.pdf 12-28-2010 Transition from KC-700 to KC-800 Sealing Glass.
CN-MW-10045-01-A.pdf 10-06-2010 New MLPQ (QFN) Package Assembly.
CN-MW-10405-01-A.pdf 08-12-2010 Alternate site for DEI3283 SOIC package assembly.
CN-MW-10402-01-C.pdf 08-12-2010 Alternate site qualified for assembly of assembly of Device Engineering Inc. small outline integrated circuit (SOIC) packages. Change of lead finish from Tin Lead SnPb to Nickel Palladium Gold (NiPdAu).
CN-MW-10404-01-A.pdf 05-02-2008 Alternate site qualified for assembly of Device Engineering Inc. Plastic Leaded Chip Carrier (PLCC) package assembly
CN-MW-10403-01-A.pdf 03-26-2008 Alternate site qualified for assembly of assembly of Device Engineering Inc. Thin-Shrink Small Outline Packages (TSSOP). Change of lead finish from Tin Lead (SnPb) to Nickel Palladium Gold (NiPdAu).
CN-MW-10400-01-A.pdf 02-01-2008 Alternate site qualified for assembly of 14 and 16 lead 150 mil “narrow” SOIC plastic packages.
CN-MW-10037-01-A.pdf 06-28-2006 Alternate Site qualified for SIDEBRAZE, PGA and LLC CERAMIC package assembly
CN-MW-10036-01-A.pdf 02-02-2005 Quality Management System Upgrade to AS9100:2004 Rev B. Change to DEI product sampling plan.
     
    © 2011-2019  Device Engineering  All rights reserved
  Power Control 
  DEI1028 Voltage Clamping Circuit
 
   
DEI1028Data Sheet

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Features:
  • Clamps transients on both avionics and industrial power busses
  • Permits use of a variety of power supplies and OP Amps
  • Small foot print (8L SOIC NB)
  • Wide input voltage range
  • Programmable Undervoltage Lockout
  • Stable over temperature
  • Active low On/Off Pin
  • Soft start
  • Highly versatile
 
       
   

GENERAL DESCRIPTION
The DEI 1028 is designed to provide the control for a power supply voltage clamp. It provides drive for a wide variety of P-Channel MOSFETS, linearly clamping the output. There is also a programmable Undervoltage Lockout feature that shuts the Power MOSFET off. Output voltage is maintained below the clamping threshold for Commercial-Off-The-Shelf switching supplies and op amps. If the clamping threshold is exceeded the out-put voltage is clamped at 35V maximum. The device is protected against a 100V spike of 100ms duration with over and undershoot protection

An open collector logic output is also provided that can be used as a power down interrupt for the system micro-processor.

 
   
Voltage Clamping Circuit Block Diagram

DEI1028 BLOCK DIAGRAM

 
       
            DEI1090 LED Driver with Square Law Dimming Control
 
       

DEI1090 Datasheet

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Features:
  • Emulates incandescent lamp "Square Law" luminance curve.
  • LED dimming controlled by Pulse Width Modulation ranging from 50HZ to 200HZ.
  • LED current adjustable from 10mA to 20mA.
  • 200:1 Dimming Range at 50Hz. 40:1 Dimming Range at 200Hz
  • Drives 8 LED outputs with matched current drive.
  • Drivers can be cascaded to synchronously drive additional LEDs.
  • Plastic 16 lead SOIC package.
 
               
           

GENERAL DESCRIPTION
The DEI1090 device is a 16 pin bipolar integrated circuit designed to drive nine LEDs and provide Pulse Width Modulated (PWM) dimming control according to the luminance curve of incandescent lamps. The device squares the analog control input and produces a PWM waveform used to enable or disable the current outputs. The LED brightness is controlled by the PWM duty cycle. All nine LEDs are driven at the same adjustable drive current. Drivers can be cascaded to synchronously drive additional LED groups. The dimming control input may be a DC or AC voltage.

 
           
LED Dimmer Block Diagram

DEI1090 BLOCK DIAGRAM

 
           
        © 2011-2019  Device Engineering  All rights reserved  

 

Product Flow Summary

Typical DEI Plastic SMT Package

 

     

     
Process Description Burn-In Standard
Incoming Wafer Inspection Yes Yes
Wafer Probe Sample Sample
Wafer Saw Yes Yes
2nd Optical Inspection Yes Yes
Die Attach Yes Yes
Wire Bond Yes Yes
3rd Optical Inspection Yes Yes
Mold & Cure Yes Yes
Mark (Laser or Ink) Yes Yes
Mark Permanency (Ink) Sample Sample
Lead Finish Yes Yes
Trim/Form/Singulation Yes Yes
Package QC Final Visual & Lot Acceptance Yes Yes
Pre-Electrical Visual Inspection Yes Yes
Pre Burn-In Electrical Test, Room/Hot/Cold 100% Room & Hot, Sample Cold No
HTRB Burn-in, 125°C, 160hr 100% No
Electrical Test, Room Temperature 100% 100%
Electrical Test, Hot Temperature 100% 100%
Electrical Test, Cold Temperature 0.65% AQL 0.65% AQL
Final Visual & Coplanarity Inspection 100% 100%
Bake & Dry Pack Yes Yes
Pack & Ship Yes Yes

 

Device Engineering is an AS9100:2009 Rev.D and ISO9001:2015 certified design and manufacturing facility specializing in Analog and Mixed Signal Integrated Circuits.

© 2011-2019  Device Engineering  All rights reserved

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