Device Engineering can package your custom circuits in any standard package available in the industry from DIPs to BGAs. Non Standard packages such as heat spreaders are also available.

• DIP (Plastic, Ceramic, Side Brazed)
• SOIC - NB(150mil) or WB(300mil)
• SSOP
• TSSOP
• PLCC
• MQFP
• MLPQ
• BGA
• µBGA
• Many more...

Packaging info for standard products

© 2011-2019  Device Engineering  All rights reserved