| Custom Circuit Process Technology | ||
|
Device Engineering possesses design experience in a broad range of Analog and Mixed-Signal IC Processes Designs have been completed in CMOS, Bipolar, BiCMOS, SiGe, HVCMOS, and SiC technologies for customers in Military, Avionics, Commercial, and Industrial markets. The table below compares different technologies available from DEI.
|
|
|
| Bipolar | CMOS | BiCMOS | SiGe | HVCMOS | SiC | |
| Bipolar Devices | Good Performance | None/Intrinsic | Medium Performance | Intrinsic | ||
| CMOS Devices | None | Good Performance | Good Performance | Good Performance | ||
| Design Layers | 9-13 | 14-18 | 18-24 | -20 | ||
| Drive Capability | Very High | Need Large Devices | Use Bipolar | Use Intrinsic Bipolars | ||
| Low Voltage Capability | Low | Medium | Lowest | Lower | Medium | |
| High Voltage Capability | Better (65V) | Best (1600V) | ||||
| Power Consumption |
Medium |
Low | Lower | Lowest | Low | |
|
Digital Density |
Medium | Very Good | Very Good | Best | Very Good | |
| Analog Density | Very Good | Good | Better | Best | Good | |
| Noise | Lowest | Medium | Use Bipolar Elements | Best | Medium | |
| Speed | ||||||
| Production NRE | Lowest | Medium | High | Highest | Medium |
Device Engineering is a Tempe, AZ based design and manufacturing facility specializing in Analog and Mixed Signal Integrated Circuits.
DEI has a Quality Management System (QMS) that is AS9100D and ISO9001:2015 certified.
© 2011-2019 Device Engineering All rights reserved