Product Flow Summary
Typical DEI Plastic SMT Package
Process Description | Burn-In | Standard |
Incoming Wafer Inspection | Yes | Yes |
Wafer Probe | Sample | Sample |
Wafer Saw | Yes | Yes |
2nd Optical Inspection | Yes | Yes |
Die Attach | Yes | Yes |
Wire Bond | Yes | Yes |
3rd Optical Inspection | Yes | Yes |
Mold & Cure | Yes | Yes |
Mark (Laser or Ink) | Yes | Yes |
Mark Permanency (Ink) | Sample | Sample |
Lead Finish | Yes | Yes |
Trim/Form/Singulation | Yes | Yes |
Package QC Final Visual & Lot Acceptance | Yes | Yes |
Pre-Electrical Visual Inspection | Yes | Yes |
Pre Burn-In Electrical Test, Room/Hot/Cold | 100% Room & Hot, Sample Cold | No |
HTRB Burn-in, 125°C, 160hr | 100% | No |
Electrical Test, Room Temperature | 100% | 100% |
Electrical Test, Hot Temperature | 100% | 100% |
Electrical Test, Cold Temperature | 0.65% AQL | 0.65% AQL |
Final Visual & Coplanarity Inspection | 100% | 100% |
Bake & Dry Pack | Yes | Yes |
Pack & Ship | Yes | Yes |
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