Product Flow Summary
Typical DEI Plastic SMT Package
| Process Description | Burn-In | Standard |
| Incoming Wafer Inspection | Yes | Yes |
| Wafer Probe | Sample | Sample |
| Wafer Saw | Yes | Yes |
| 2nd Optical Inspection | Yes | Yes |
| Die Attach | Yes | Yes |
| Wire Bond | Yes | Yes |
| 3rd Optical Inspection | Yes | Yes |
| Mold & Cure | Yes | Yes |
| Mark (Laser or Ink) | Yes | Yes |
| Mark Permanency (Ink) | Sample | Sample |
| Lead Finish | Yes | Yes |
| Trim/Form/Singulation | Yes | Yes |
| Package QC Final Visual & Lot Acceptance | Yes | Yes |
| Pre-Electrical Visual Inspection | Yes | Yes |
| Pre Burn-In Electrical Test, Room/Hot/Cold | 100% Room & Hot, Sample Cold | No |
| HTRB Burn-in, 125°C, 160hr | 100% | No |
| Electrical Test, Room Temperature | 100% | 100% |
| Electrical Test, Hot Temperature | 100% | 100% |
| Electrical Test, Cold Temperature | 0.65% AQL | 0.65% AQL |
| Final Visual & Coplanarity Inspection | 100% | 100% |
| Bake & Dry Pack | Yes | Yes |
| Pack & Ship | Yes | Yes |
Device Engineering is an AS9100:2009 Rev.D and ISO9001:2015 certified design and manufacturing facility specializing in Analog and Mixed Signal Integrated Circuits.