Product Flow Summary

Typical DEI Plastic SMT Package



Process Description Burn-In Standard
Incoming Wafer Inspection Yes Yes
Wafer Probe Sample Sample
Wafer Saw Yes Yes
2nd Optical Inspection Yes Yes
Die Attach Yes Yes
Wire Bond Yes Yes
3rd Optical Inspection Yes Yes
Mold & Cure Yes Yes
Mark (Laser or Ink) Yes Yes
Mark Permanency (Ink) Sample Sample
Lead Finish Yes Yes
Trim/Form/Singulation Yes Yes
Package QC Final Visual & Lot Acceptance Yes Yes
Pre-Electrical Visual Inspection Yes Yes
Pre Burn-In Electrical Test, Room/Hot/Cold 100% Room & Hot, Sample Cold No
HTRB Burn-in, 125°C, 160hr 100% No
Electrical Test, Room Temperature 100% 100%
Electrical Test, Hot Temperature 100% 100%
Electrical Test, Cold Temperature 0.65% AQL 0.65% AQL
Final Visual & Coplanarity Inspection 100% 100%
Bake & Dry Pack Yes Yes
Pack & Ship Yes Yes


Device Engineering is an AS9100:2009 Rev.D and ISO9001:2015 certified design and manufacturing facility specializing in Analog and Mixed Signal Integrated Circuits.

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Device Engineering Incorporated
6031 South Maple Avenue
Tempe AZ 85283

P: 480-303-0822

F: 480-303-0824