Business Ethics

   
 
 
 

Device Engineering can package your custom circuits in any standard package available in the industry from DIPs to BGAs. Non Standard packages such as heat spreaders are also available.

  • DIP (Plastic, Ceramic, Side Brazed)
  • SOIC - NB(150mil) or WB(300mil)
  • SSOP
  • TSSOP
  • PLCC
  • MQFP
  • MLPQ
  • BGA
  • µBGA
  • Many more...
 
 

Packaging info for standard products

   

Our Services

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Contact Us

Device Engineering Incorporated
6031 South Maple Avenue
Tempe AZ 85283

P: 480-303-0822

F: 480-303-0824

www.deiaz.com