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Device Engineering can package your custom circuits in any standard package available in the industry from DIPs to BGAs. Non Standard packages such as heat spreaders are also available.

  • DIP (Plastic, Ceramic, Side Brazed)
  • SOIC - NB(150mil) or WB(300mil)
  • SSOP
  • PLCC
  • MQFP
  • MLPQ
  • BGA
  • µBGA
  • Many more...

Packaging info for standard products


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Device Engineering Incorporated
6031 South Maple Avenue
Tempe AZ 85283

P: 480-303-0822

F: 480-303-0824